The launch of the Xbox 360 was not without its problems. From low inventory to repeated rumblings online about defective and overheating units, Microsoft found itself with a more trouble than it bargained for from day one. While the early launch was important to cash in on holiday shopping demand and gain a headstart on Sony’s much-anticipated PS3, it seems like since the units have hit the shelves Microsoft's highest priority has been dealing with the problems the early launch created.
One launch-time issue—supply constraints—appears to be solved. Now there are many more 360 units on the shelves in most areas, but what about the heat problems that plagued some units?
In an attempt to cut down on the power issues, MS will switch to a version of the Xenon CPU fabbed on a 65nm die process, beginning in 2007. The CPUs will be made by Chartered Semiconductor in Singapore, under license from IBM and Microsoft.
We are excited to expand our manufacturing relationship with Microsoft and leverage the innovative 65nm SOI technology made available to us through our agreement with IBM," said Kay Chai "KC" Ang, senior vice president of fab operations at Chartered. "This is both a recognition of Chartered's 300mm manufacturing excellence and increasing customer confidence in our ability to enable cutting-edge technologies as products transition to 65nm. By working closely with IBM to enable manufacturing compatibility and dual-sourcing capability, our goal is to continue to be a reliable manufacturing source to Microsoft."
Having a cooler CPU will have a ripple effect on the 360; many of the design decisions were dependent on how much heat the CPU created while running graphics-intensive games. The power supply was moved outside of the system into one of the largest power bricks ever designed for a piece of consumer electronics, and the active cooling system is also uncommonly loud for a console. Even with these cooling solutions in place, the system can become uncomfortably hot to the touch, which doesn’t inspire confidence in the long-term survival of the components.
While the complaints about systems overheating and shutting down were scattered at best and no solid numbers exist to tell us how many 360s were shipped defective, the move to a smaller die should help alleviate concerns about heating issues. Regardless of whether it leads to component breakdown, many consumers have to be bothered by running a system that can noticeably heat up the rest of their components in an entertainment center.
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